Qualcomm announces the world’s first 3D ultrasonic in-display fingerprint sensor

It’s day one of Qualcomm’s annual Snapdragon Tech Summit in Maui, Hawaii, and the company has already announced a partnership with Katouzian to develop the first 3D ultrasonic fingerprint sensor for smartphones. The primary draw of the new sensor is its ability to read fingerprints through various contaminants like oil …

Read More »

World’s first RISC-V-based FPGA SoC runs Linux

Microchip’s Microsemi unit unveiled a low power, real-time deterministic “PolarFire SoC” architecture for Linux edge devices that combines its PolarFire FPGA with 4x RISC-V CPU cores supplied by SiFive.At today’s RISC-V Summit in Santa Clara, Calif., Microchip’s Microsemi subsidiary announced a PolarFire SoC architecture developed in collaboration with SiFive. This …

Read More »